Method for fabricating a mask ROM

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07087488

ABSTRACT:
The present invention discloses a method for fabricating a buried bit line of a mask ROM. The method includes providing a semiconductor substrate with a photoresist layer, and patterning the photoresist layer to form a photoresist pattern. A first ion implantation process is performed to form a first doped region in the semiconductor substrate not covered by the photoresist pattern. Then, an organic layer is coated on the photoresist pattern and the semiconductor substrate and an etching process is performed to form an organic spacer at two sides of the photoresist pattern. Finally, a second ion implantation process forms a second doped region in the semiconductor substrate not covered by the photoresist pattern and the organic spacer. Finally, the photoresist pattern and the organic spacer are removed.

REFERENCES:
patent: 6586303 (2003-07-01), Wu
patent: 2004/0029347 (2004-02-01), Chang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating a mask ROM does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a mask ROM, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a mask ROM will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3698835

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.