Method for fabricating a gate structure

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S704000, C438S706000, C438S715000, C438S785000, C438S508000

Reexamination Certificate

active

08048733

ABSTRACT:
An method of fabricating the gate structure comprises: sequentially depositing and patterning a dummy oxide layer and a dummy gate electrode layer on a substrate; surrounding the dummy oxide layer and the dummy gate electrode layer with a nitrogen-containing dielectric layer and an interlayer dielectric layer; removing the dummy gate electrode layer; removing the dummy oxide layer by exposing a surface of the dummy oxide layer to a vapor mixture comprising NH3 and a fluorine-containing compound at a first temperature; heating the substrate to a second temperature to form an opening in the nitrogen-containing dielectric layer; depositing a gate dielectric; and depositing a gate electrode.

REFERENCES:
patent: 6284146 (2001-09-01), Kim et al.
patent: 6440808 (2002-08-01), Boyd et al.
patent: 2008/0265322 (2008-10-01), Lin et al.
patent: 2010/0124818 (2010-05-01), Lee et al.
patent: 2010/0255654 (2010-10-01), Lin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating a gate structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a gate structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a gate structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4301328

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.