Method for fabricating a dual-gate dielectric module for memory

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438258, 438275, H01L 21336, H01L 218234

Patent

active

060372222

ABSTRACT:
A method of manufacturing a memory device having embedded logic. The memory and logic FETS have two different two gate oxide 20 34 thicknesses. The method integrates (1) a salicide contact process 72 74 (logic devices) and dual gate (N+/P+) logic gate 24A 24B technology with (2) memory device Polycide with Self aligned Contact 80 Technology. The method comprises:

REFERENCES:
patent: 5057449 (1991-10-01), Lowery et al.
patent: 5455444 (1995-10-01), Hsue
patent: 5532181 (1996-07-01), Takebuchi et al.
patent: 5658812 (1997-08-01), Araki
patent: 5668035 (1997-09-01), Fang et al.
patent: 5672521 (1997-09-01), Barsan et al.
patent: 5834352 (1998-11-01), Choi
patent: 5897349 (1999-04-01), Agnello
patent: 5936279 (1999-08-01), Chuang

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating a dual-gate dielectric module for memory does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a dual-gate dielectric module for memory , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a dual-gate dielectric module for memory will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-168768

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.