Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Reexamination Certificate
2007-05-07
2010-11-09
Meeks, Timothy H (Department: 1715)
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
C427S569000, C427S255700
Reexamination Certificate
active
07829158
ABSTRACT:
A method of forming a tantalum containing multi-layer film. In one embodiment, the method includes disposing a substrate in a process chamber, heating the substrate, exposing the substrate to a tantalum containing precursor to adsorb at least a portion of the tantalum containing precursor on a surface of the substrate, purging the process chamber with a purge gas, and exposing the substrate to a process space comprising helium and hydrogen ionized at a first radio frequency power to form a first tantalum containing layer on the surface. The method further includes exposing the substrate to the tantalum containing precursor to adsorb at least a portion of the precursor on the first tantalum containing layer, purging the process chamber with the purge gas, and exposing the substrate to the process space at a second radio frequency power to form a second tantalum containing layer, where the second radio frequency power is different from the first radio frequency power.
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Meeks Timothy H
Miller, Jr. Joseph
Tokyo Electron Limited
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