Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-05-10
2005-05-10
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S563000
Reexamination Certificate
active
06890825
ABSTRACT:
An improved dopant application system and method for the manufacture of microelectronic devices accurately places dopant on and within a dielectric or semiconductor surface. Diffusing and activating p-type and n-type dopants in dielectric or semiconductor substrates is achieved by means of electron beam irradiation.
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A.C. Greenwald, et al. “Pulsed-Electron-Beam Annealing of Ion-Implantation Damage”, Spire Corporation, Bedford, Massachusetts 01730 (Accepted for Publication Aug. 22, 1978), J. Appl. Phys. 50(2), Feb. 1979, 1979 American Institute of Physics, pp. 783-787.
Hannes Charles
Livesay William R.
Ross Matthew F.
Applied Materials Inc.
Roberts & Roberts
Tsai H. Jey
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