Etching a substrate: processes – Gas phase etching of substrate – With measuring – testing – or inspecting
Reexamination Certificate
2008-07-01
2008-07-01
Ahmed, Shamim (Department: 1792)
Etching a substrate: processes
Gas phase etching of substrate
With measuring, testing, or inspecting
C216S060000, C438S014000, C438S016000
Reexamination Certificate
active
07393459
ABSTRACT:
A method for automatic determination of a state of a substrate in a plasma processing chamber is provided. Substrate reflectance data is collected in a processing chamber prior to processing to be analyzed with reference reflectance data to determine if the substrate state meets a control criterion. The substrate state may define the thickness and the qualities of the films on the substrate, the critical dimensions of the different layers on the substrate. The reflectance data is analyzed using a multi-variant analysis technique, such as principle component analysis. In addition to analyzing substrate state prior to processing, substrate reflectance could also be collected in a processing chamber during processing to be analyzed with reference reflectance data to further determine if the substrate state and/or the substrate processing are meeting a control criterion.
REFERENCES:
patent: 5536359 (1996-07-01), Kawada et al.
patent: 6419846 (2002-07-01), Toprac et al.
patent: 6521080 (2003-02-01), Balasubramhanya et al.
patent: 6566270 (2003-05-01), Liu et al.
patent: 6829056 (2004-12-01), Barnes et al.
patent: 2002/0119660 (2002-08-01), Sarfaty et al.
patent: 2003/0192864 (2003-10-01), Tanaka et al.
patent: 2004/0084406 (2004-05-01), Kamp et al.
patent: WO 03/077303 (2003-09-01), None
Yue, et al., “Plasma etching endpoint detection using multiple wavelengths for small open-area wafers,” J. Vac. Sci, Technol. A, 19(1), Jan./Feb. 2001, 66-75.
Davis Matthew F
Lian Lei
Walker Quentin E.
Ahmed Shamim
Applied Materials Inc.
Patterson & Sheridan LLP
LandOfFree
Method for automatic determination of substrates states in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for automatic determination of substrates states in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for automatic determination of substrates states in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2770820