Method and system for clamping semiconductor wafers

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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156345, 20429835, 118503, C23F 102

Patent

active

052620298

ABSTRACT:
A wafer clamping mechanism includes a clamp ring having a central opening corresponding to the geometry of a conventional semiconductor wafer. An overhang located about the opening engages the corresponding semiconductor wafer when in place on an electrode of a plasma reactor. The clamp ring is resiliently mounted on a housing which holds a second electrode. The clamp ring is automatically engaged against the wafer as the spacing between the two electrodes is adjusted to a desired gap width. A raised annular barrier on the lower electrode circumscribes the wafer and engages a mating surface on the clamp ring in order to enhance alignment of the clamp.

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