Method and system for a pattern layout split

Computer-aided design and analysis of circuits and semiconductor – Design of semiconductor mask or reticle – Layout generation

Reexamination Certificate

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Reexamination Certificate

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07934177

ABSTRACT:
A method for splitting a pattern layout including providing the pattern layout having features, checking the pattern layout to determine the features that require splitting, coloring the features that require splitting with a first and second color, resolving coloring conflicts by decomposing the feature with the coloring conflict and coloring the decomposed feature with the first and second color, and generating a first mask with features of the first color and a second mask with features of the second color.

REFERENCES:
patent: 6335981 (2002-01-01), Harazaki
patent: 6541166 (2003-04-01), Mansfield et al.
patent: 2002/0076622 (2002-06-01), Pierrat et al.
patent: 2002/0124235 (2002-09-01), Yamashita
patent: 2007/0031738 (2007-02-01), Huckabay
patent: 2007/0031740 (2007-02-01), Chen et al.
patent: 2006-124879 (2006-11-01), None
Chinese Patent Office, Office Action mailed Nov. 6, 2009, 4 pages, for Application No. 2007101294093.

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