Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Reexamination Certificate
2004-05-11
2008-11-11
Huff, Mark F. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
C430S022000, C430S030000, C430S395000, C430S311000, C430S396000
Reexamination Certificate
active
07449284
ABSTRACT:
A method for fabricating mechanical structures from bonding substrates. The method includes providing a bonded substrate structure, which includes a first substrate having a first thickness of silicon material and a first face. The bonded substrate also includes a second substrate having a second thickness and a second face. At least the first substrate or at least the second substrate (or both) has an alignment mark comprising a front-size zero mark within a portion of either the first thickness or the second thickness. The method includes applying a layer of photomasking material overlying a first backside surface of the first substrate. The method includes illuminating electromagnetic radiation using a coherent light source through the layer of photoresist material and through a portion of the first thickness. The method includes detecting an indication of the alignment mark using a signal associated with a portion of the electromagnetic radiation from a second backside of the second substrate. The method also includes exposing a portion of the layer of photomasking material once a pattern a portion of a reticle structure has been aligned using the alignment mark.
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Huff Mark F.
Miradia Inc.
Sullivan Caleen O
Townsend and Townsend / and Crew LLP
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