Method and device for polishing semiconductor wafers

Details Method and device for polishing semiconductor wafers Method and device for polishing semiconductor wafers

1997-12-09

1999-11-09

Scherbel, David A.

Abrading

Precision device or process - or with condition responsive...

With indicating

451288, 451289, B24B 4900, B24B 5100, B24B 2900, B24B 500

Patent

active

059803614

ABSTRACT:
A method is for the polishing of semiconductor wafers, which are mounted on a front side of a support plate and one side face of which is pressed anst a polishing plate, which is covered with a polishing cloth, with a specific polishing pressure and polished. A device is provided which is suitable for carrying out the method. The method includes a) applying a specific pressure to at least one of a plurality of pressure chambers prior to the polishing of the semiconductor wafers, and b) during the polishing of the semiconductor wafers, transmitting the polishing pressure to a rear side of the support plate via elastic bearing surfaces of the pressure chambers to which pressure has been applied.

REFERENCES:
patent: 5441444 (1995-08-01), Nakajima
patent: 5479414 (1995-12-01), Hirose et al.
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5624299 (1997-04-01), Shendon
patent: 5645474 (1997-07-01), Kubo et al.
English Derwent Abstract Corresponding to EP 0 004033 A1 (79-H9837B[38]).

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