Method and apparatus for wafer cleaning

Cleaning and liquid contact with solids – Processes – With work or work parts movable during treatment

Reexamination Certificate

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Details

C134S034000, C134S036000, C134S037000, C134S030000, C134S902000

Reexamination Certificate

active

07819985

ABSTRACT:
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

REFERENCES:
patent: 3182671 (1965-05-01), Vorie
patent: 4350562 (1982-09-01), Bonu
patent: 4401131 (1983-08-01), Lawson
patent: 4544446 (1985-10-01), Cady
patent: 4645474 (1987-02-01), Kubo et al.
patent: 4736130 (1988-04-01), Puskas
patent: 4804007 (1989-02-01), Bran
patent: 4979994 (1990-12-01), Dussault et al.
patent: 5108512 (1992-04-01), Goffnett et al.
patent: 5158100 (1992-10-01), Tanaka et al.
patent: 5235995 (1993-08-01), Bergman et al.
patent: 5379785 (1995-01-01), Ohmori et al.
patent: 5518542 (1996-05-01), Matsukawa et al.
patent: 5834871 (1998-11-01), Puskas
patent: 5865199 (1999-02-01), Pedziwiatr et al.
patent: 5909741 (1999-06-01), Ferrell
patent: 5979475 (1999-11-01), Satoh et al.
patent: 5984391 (1999-11-01), Vanderpot et al.
patent: 5996601 (1999-12-01), Kern et al.
patent: 6016821 (2000-01-01), Puskas
patent: 6021789 (2000-02-01), Akatsu et al.
patent: 6021791 (2000-02-01), Dryer et al.
patent: 6036785 (2000-03-01), Ferrell
patent: 6090534 (2000-07-01), Costigan et al.
patent: 6115867 (2000-09-01), Nakashima et al.
patent: 6143081 (2000-11-01), Shinriki et al.
patent: 6181052 (2001-01-01), Puskas
patent: 6276370 (2001-08-01), Fisch et al.
patent: 6313565 (2001-11-01), Puskas
patent: 6315836 (2001-11-01), Oka et al.
patent: 6334902 (2002-01-01), Mertens et al.
patent: 6370791 (2002-04-01), Weaver et al.
patent: 6374836 (2002-04-01), Oroku
patent: 6431184 (2002-08-01), Taniyama
patent: 6435200 (2002-08-01), Langen
patent: 6460552 (2002-10-01), Lorimer
patent: 6505634 (2003-01-01), Son et al.
patent: 6539952 (2003-04-01), Itzkowitz
patent: 6595224 (2003-07-01), Miranda et al.
patent: 7334588 (2008-02-01), Verhaverbeke et al.
patent: 2002/0029788 (2002-03-01), Verhaverbeke et al.
patent: 2002/0157685 (2002-10-01), Hayamizu
patent: 2008/0314424 (2008-12-01), Verhaverbeke et al.
patent: 2009/0020144 (2009-01-01), Verhaverbeke et al.
patent: 0 858 099 (1998-08-01), None
patent: H3-258381 (1991-11-01), None
patent: H4-213826 (1992-08-01), None
patent: 05013396 (1993-01-01), None
patent: 10163153 (1998-06-01), None
patent: WO 98 01896 (1998-01-01), None
patent: WO 98/14985 (1998-04-01), None
patent: WO 00/21692 (2000-04-01), None
“Powerful Solutions for Critical Cleaning”. ProSys, Product Systems, Inc., 1p., 1998 http://www.prosysmeg.com/body—index.html.
“Ultrasonic Cleaning—Fundamental Theory and Application”, PMR Systems, 2 pp. Jun. 5, 2000 http://www.pmrsystems.com/page10.html.
“Advanced Megasonic Cleaning”. Vennerbeck, R., 9 pp., Jun. 5, 2000 http://www.pmrsystems.com/presentations/DVFPS98-Final/sId001.htm.
“Polymer Piezoelectric Transducers For Ultrasonic NDE”. Bar-Cohen, et al., 8 pp., Sep. 1996, http://www.ndt.net/article/yosi/yosi.htm.
“Piezoelectric Transducers”, 1 p., Feb. 20, 1998 http://www.bae.ncsu.edu/bae/research/bla...k/electrodes/projects/sensors/piezo.html.
“Comment on Particle Removal Mechanisms Via Megasonic Energy”, Wu, et al., Verteq, Inc., Jun. 5, 2000; 3 pp., http://www.verteq.com/company/papers/VRTQ—MegMech1.htm.
“Typical Uses/Definition of Material Properties”. Channel Industries, Jun. 5, 2000; 2 pp. http://www.sonatech.com/page04.htm.
“Piezoelectric Ceramic”, Channel Industries-, Jun. 5, 2000, 3 pp. http://sonatech.com/page03.htm.
“ What is the venturi affect?”, Van Dien, Nature.Net; Dec. 13, 1999, 6 pp. http://www.nature.net/forums/load/weather/msg12161915959.html.
“What is the Boundary Layer as it Relates to Megasonic Cleaning?”, ProSys, Jun. 5, 2000, 3.pp. http://www.prosysmeg.com/html/body—boundary-layer.html.
“Megasonic Cleaning System, Model 2000 SS”, Jun. 5, 2000, 2 pp. http://www.seamboatsemi.com/equipment/megasonic.html.
“Megasonic Cleaning-What is megasonic cleaning?”, Jun. 5, 2000, 3 pp. http://www.prosysmeg.com/html/body—megasonics.html.
“The Semiconductor Manufacturing Process: Wafer Lapping & Polishing”. Fullman-Kinetics; Jun. 18, 2000, 2 pp.
“19thAnnual Semiconductor Pure Water and Chemicals Conference”, 2000 Proceedings Mar. 13-16, 2000, Santa Clara Convention Center, Santa Clara, CA—pp. 318-328, 13 pp.
International Search Report—PCT/US 01/20466—9 pages.
International Preliminary Examiner Report, PCT/US01/20466, 3 pages.

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