Cleaning and liquid contact with solids – Apparatus – With movable means to cause fluid motion
Reexamination Certificate
2001-06-25
2008-11-18
Markoff, Alexander (Department: 1792)
Cleaning and liquid contact with solids
Apparatus
With movable means to cause fluid motion
C134S157000, C134S001000, C134S001300, C134S902000
Reexamination Certificate
active
07451774
ABSTRACT:
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
REFERENCES:
patent: 4401131 (1983-08-01), Lawson
patent: 4804007 (1989-02-01), Bran
patent: 5158100 (1992-10-01), Tanaka et al.
patent: 5235995 (1993-08-01), Bergman et al.
patent: 5379785 (1995-01-01), Ohmori et al.
patent: 5909741 (1999-06-01), Ferrell
patent: 5979475 (1999-11-01), Satoh et al.
patent: 5996601 (1999-12-01), Kern et al.
patent: 6021789 (2000-02-01), Akatsu et al.
patent: 6021791 (2000-02-01), Dryer et al.
patent: 6036785 (2000-03-01), Ferrell
patent: 6276370 (2001-08-01), Fisch et al.
patent: 6313565 (2001-11-01), Puskas
patent: 6334902 (2002-01-01), Mertens et al.
patent: 6431184 (2002-08-01), Taniyama
patent: 6460552 (2002-10-01), Lorimer
patent: 6505634 (2003-01-01), Son et al.
patent: 6539952 (2003-04-01), Itzkowitz
patent: 6595224 (2003-07-01), Miranda et al.
patent: 7334588 (2008-02-01), Verhaverbeke et al.
patent: 2002/0157685 (2002-10-01), Hayamizu
patent: 0 858 099 (1998-08-01), None
patent: H3-258381 (1991-11-01), None
patent: H4-213826 (1992-08-01), None
patent: 05013396 (1993-01-01), None
patent: WO 98 01896 (1998-01-01), None
patent: WO 98/14985 (1998-04-01), None
patent: WO 00/21692 (2000-04-01), None
International Search Report—PCT/US01/20466—9 pages.
“Powerful Solutions for Critical Cleaning”. ProSys, Product Systems, Inc., 1p., 1998 http://www.prosysmeg.com/body—index.html.
“Ultrasonic Cleaning—Fundamental Theory and Application”, PMR Systems, 2 pp. Jun. 5, 2000 http://www.pmrsystems.com/page10.html.
“Advanced Megasonic Cleaning”. Vennerbeck, R., 9 pp., Jun. 5, 2000 http://www.pmrsystems.com/presentations/DVFPS98-Final/sld001.htm.
“Polymer Piezoelectric Transducers For Ultrasonic NDE”. Bar-Cohen, et al., 8 pp., Sep. 1996, http://www.ndt.net/article/yosi/yosi.htm.
“Piezoelectric Transducers”, 1 p., Feb. 20, 1998 http://www.bae.ncsu.edu/bae/research/bla . . . k/electrodes/projects/sensors/piezo.html.
“Comment on Particle Removal Mechanisms Via Megasonic Energy”, Wu, et al., Verteq, Inc., Jun. 5, 2000; 3 pp., http://www.verteq.com/company/papers/VRTQ—MegMech1.htm.
“Typical Uses/Definition of Material Properties”. Channel Industries, Jun. 5, 2000; 2 pp. http://www.sonatech.com/page04.htm.
“Piezoelectric Ceramic”, Channel Industries-, Jun. 5, 2000, 3 pp. http://sonatech.com/page03.htm.
“What is the venturi affect?”, Van Dien, Nature.Net; Dec. 13, 1999, 6 pp. http://www.nature.net/forums/load/weather/msg12161915959.html.
“What is the Boundary Layer as it Relates to Megasonic Cleaning?”, ProSys, Jun. 5, 2000, 3.pp. http://www.prosysmeg.com/html/body—boundary-layer.html.
“Megasonic Cleaning System, Model 2000 SS”, Jun. 5, 2000, 2 pp. http://www.seamboatsemi.com/equipment/megasonic.html.
“Megasonic Cleaning-What is megasonic cleaning?”, Jun. 5, 2000, 3 pp. http://www.prosysmeg.com/html/body—megasonics.html.
“The Semiconductor Manufacturing Process: Wafer Lapping & Polishing”. Fullman-Kinetics; Jun. 18, 2000, 2 pp.
“19thAnnual Semiconductor Pure Water and Chemicals Conference”, 2000 Proceedings Mar. 13-16, 2000, Santa Clara Convention Center, Santa Clara, CA—pp. 318-328, 13 pp. Ohmi et al.
Endo Rick R.
Ko Alexander
Truman J. Kelly
Verhaverbeke Steven
Applied Materials Inc.
Blakely , Sokoloff, Taylor & Zafman LLP
Markoff Alexander
LandOfFree
Method and apparatus for wafer cleaning does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for wafer cleaning, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for wafer cleaning will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4043655