Method and apparatus for the application of materials

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20419212, 204298, C23C 1446

Patent

active

048850705

ABSTRACT:
An apparatus to apply materials to a substrate disposed in a vacuum chamber is disclosed. A separate generator chamber containing an electron emitter is connected to the vacuum chamber by a process chamber so that a plasma of controllable cross-sectional shape and large area is formed and guided by magnets toward a target system. Positive ions may be accelerated against the target by applying an adjustable negative voltage.

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