Method and apparatus for photomask plasma etching

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With mechanical mask – shield or shutter for shielding workpiece

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S345330, C438S731000

Reexamination Certificate

active

07943005

ABSTRACT:
A method and apparatus for etching photomasks is provided herein. In one embodiment, the apparatus comprises a process chamber having a support pedestal adapted for receiving a photomask. An ion-neutral shield is disposed above the pedestal and a deflector plate assembly is provided above the ion-neutral shield. The deflector plate assembly defines a gas flow direction for process gases towards the ion-neutral shield, while the ion-neutral shield is used to establish a desired distribution of ion and neutral species in a plasma for etching the photomask.

REFERENCES:
patent: 4496420 (1985-01-01), Frohlich et al.
patent: 4600464 (1986-07-01), Desilets et al.
patent: 5024748 (1991-06-01), Fujimura
patent: 5075256 (1991-12-01), Wang et al.
patent: 5556500 (1996-09-01), Hasegawa et al.
patent: 5593540 (1997-01-01), Tomita et al.
patent: 5605637 (1997-02-01), Shan et al.
patent: 5614026 (1997-03-01), Williams
patent: 5673922 (1997-10-01), Sherstinsky et al.
patent: 5972781 (1999-10-01), Wegleiter et al.
patent: 6129808 (2000-10-01), Wicker et al.
patent: 6167835 (2001-01-01), Ootera et al.
patent: 6190496 (2001-02-01), DeOrnellas et al.
patent: 6203657 (2001-03-01), Collison et al.
patent: 6261406 (2001-07-01), Jurgensen et al.
patent: 6270687 (2001-08-01), Ye et al.
patent: 6287643 (2001-09-01), Powell et al.
patent: 6290806 (2001-09-01), Donohoe
patent: 6299689 (2001-10-01), Wang et al.
patent: 6306244 (2001-10-01), Kennedy et al.
patent: 6335293 (2002-01-01), Luo
patent: 6339206 (2002-01-01), Johnson
patent: 6364949 (2002-04-01), Or et al.
patent: 6375748 (2002-04-01), Yudovsky et al.
patent: 6521010 (2003-02-01), Katata
patent: 6521292 (2003-02-01), Yudovsky et al.
patent: 6551447 (2003-04-01), Savas et al.
patent: 6553332 (2003-04-01), Leng
patent: 6589352 (2003-07-01), Yudovsky et al.
patent: 6656322 (2003-12-01), Hongo et al.
patent: 6676800 (2004-01-01), Festa et al.
patent: 6676803 (2004-01-01), Kim
patent: 6692649 (2004-02-01), Collison et al.
patent: 6782843 (2004-08-01), Kinnard et al.
patent: 6805779 (2004-10-01), Chistyakov
patent: 6806651 (2004-10-01), Chistyakov
patent: 6806949 (2004-10-01), Ludviksson et al.
patent: 6837966 (2005-01-01), Nishimoto et al.
patent: 6868800 (2005-03-01), Moroz
patent: 6872259 (2005-03-01), Strang
patent: 6926802 (2005-08-01), Lee
patent: 6949165 (2005-09-01), Koshimizu
patent: 7037846 (2006-05-01), Srivastava et al.
patent: 7241345 (2007-07-01), Ramamurthy et al.
patent: 7609002 (2009-10-01), Lee
patent: 2002/0033233 (2002-03-01), Savas
patent: 2002/0121501 (2002-09-01), Choquette et al.
patent: 2002/0142612 (2002-10-01), Wu et al.
patent: 2002/0185229 (2002-12-01), Brcka et al.
patent: 2002/0189762 (2002-12-01), Kim
patent: 2003/0010448 (2003-01-01), Lee
patent: 2003/0019580 (2003-01-01), Strang et al.
patent: 2003/0047536 (2003-03-01), Johnson
patent: 2003/0094643 (2003-05-01), Yang
patent: 2003/0194510 (2003-10-01), Nguyen et al.
patent: 2003/0209324 (2003-11-01), Fink
patent: 2003/0217812 (2003-11-01), Yoshiki et al.
patent: 2004/0000535 (2004-01-01), Mueller et al.
patent: 2004/0003780 (2004-01-01), Yudovsky et al.
patent: 2004/0031565 (2004-02-01), Su et al.
patent: 2004/0035532 (2004-02-01), Jung
patent: 2004/0069227 (2004-04-01), Ku et al.
patent: 2004/0079725 (2004-04-01), Inomata et al.
patent: 2004/0083975 (2004-05-01), Tong et al.
patent: 2004/0129226 (2004-07-01), Strang et al.
patent: 2004/0140053 (2004-07-01), Srivastava et al.
patent: 2004/0192043 (2004-09-01), Makita et al.
patent: 2004/0212312 (2004-10-01), Chistyakov
patent: 2004/0219737 (2004-11-01), Quon
patent: 2004/0250772 (2004-12-01), Ramamurthy et al.
patent: 2004/0261718 (2004-12-01), Kim et al.
patent: 2005/0006344 (2005-01-01), Tanaka
patent: 2005/0011447 (2005-01-01), Fink
patent: 2005/0066902 (2005-03-01), Fink
patent: 2005/0087302 (2005-04-01), Mardian et al.
patent: 2005/0133164 (2005-06-01), Fischer et al.
patent: 2005/0139317 (2005-06-01), Wu et al.
patent: 2005/0241767 (2005-11-01), Ferris et al.
patent: 2005/0263070 (2005-12-01), Fink
patent: 2005/0284370 (2005-12-01), Strang
patent: 2006/0000802 (2006-01-01), Kumar et al.
patent: 2006/0000805 (2006-01-01), Todorow et al.
patent: 2006/0060303 (2006-03-01), Fink et al.
patent: 2006/0213865 (2006-09-01), Honda et al.
patent: 2006/0260747 (2006-11-01), Hirose et al.
patent: 2007/0000614 (2007-01-01), Hatamura et al.
patent: 2007/0017898 (2007-01-01), Kumar et al.
patent: 2007/0044719 (2007-03-01), Ku et al.
patent: 2008/0072823 (2008-03-01), Yudovsky et al.
patent: 2008/0099426 (2008-05-01), Kumar et al.
patent: 2008/0101978 (2008-05-01), Ryabova et al.
patent: 0488393 (1992-06-01), None
patent: 0496564 (1992-07-01), None
patent: 0522296 (1993-01-01), None
patent: 0702392 (1995-03-01), None
patent: 0 702 392 (1996-03-01), None
patent: 0930642 (1999-07-01), None
patent: 1024520 (2000-08-01), None
patent: 1355342 (2003-10-01), None
patent: 1 612 840 (2006-01-01), None
patent: 1612840 (2006-01-01), None
patent: 1686421 (2006-08-01), None
patent: 62299031 (1987-12-01), None
patent: 02-184029 (1990-07-01), None
patent: 08-148473 (1996-06-01), None
patent: 9115836 (1997-05-01), None
patent: 11067727 (1999-03-01), None
patent: 2004165298 (2004-06-01), None
patent: 20010039233 (2001-05-01), None
patent: 2005-0067405 (2005-07-01), None
patent: 2006-0048674 (2006-05-01), None
patent: 502290 (2002-09-01), None
patent: WO-9850600 (1998-11-01), None
patent: WO-03/036704 (2003-05-01), None
patent: WO-03/054912 (2003-07-01), None
patent: WO03054912 (2003-07-01), None
patent: 2007/015504 (2007-02-01), None
patent: WO-2007/015504 (2007-02-01), None
Notice to File a Response for Korean Patent Application No. 10-2007-0086475 dated Dec. 24, 2009.
Office Action dated Jan. 5, 2010 for corresponding U.S. Appl. No. 11/554,495.
Notice to File a Response from the Korean Intellectual Property Office dated Dec. 11, 2008 for corresponding Korean Patent Application No. 10-2007-0086475. A Concise Statement of Relevance is provided.
Notice to File a Response from the Korean Intellectual Property Office dated Jun. 23, 2009 for corresponding Korean Patent Application No. 10-2007-0086475. A Concise Statement of Relevance is provided.
Notice to File a Response from the Korean Intellectual Property Office dated Dec. 24, 2009 for corresponding Korean Patent Application No. 10-2007-0086475. A Concise Statement of Relevance is provided.
European Patent Office Communication pursuant to Rule 69 EPC dated Feb. 28, 2008 for corresponding European Patent Application No. 07020930.9.
Extended European Search Report for EP 07020930.9 mailed Feb. 28, 2008.
Extended European Search Report for EP 07020937.7 mailed Apr. 18, 2008.
EP Search Report, Apr. 18, 2008, consists of 9 unnumbered pages.
Official Letter dated Jun. 24, 2009 from Korean Patent Office for corresponding Korean Patent application 10-2007-0086473. A Concise Statement of Relevance is provided.
Official Letter datred Jun. 23, 2009 from Korean Patent Office for corresponding Korean Patent application 10-2007-0086475. A Concise Statement of Relevance is provided.
Chinese First Office Action dated Apr. 29, 2010 for Chinese Application No. 200710143238.X.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for photomask plasma etching does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for photomask plasma etching, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for photomask plasma etching will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2619517

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.