Method and apparatus for monitoring the deposition rate of films

Optics: measuring and testing – By configuration comparison – With photosensitive film or plate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

25055927, 438 16, 427 10, G01B 1106

Patent

active

057542970

ABSTRACT:
A deposition rate monitor based on the measurement of optical attenuation is described for use in deposition equipment such as sputtering systems used to deposit thin metal films on semiconductor devices. A beam of light is passed through the region between a deposition source and the deposition substrate. The beam of light is attenuated by the material being transported from the source to the substrate before the light is detected at a detector. The level of attenuation of the light passing through the deposition environment can be empirically related to the rate at which material is being deposited on the substrate. The optical absorption deposition rate monitor can be used to adjust processing variables to maintain a constant deposition rate.

REFERENCES:
patent: 3373278 (1968-03-01), Cilyo
patent: 3654109 (1972-04-01), Hohl et al.
patent: 3804532 (1974-04-01), Patten et al.
patent: 3892490 (1975-07-01), Uetsuki et al.
patent: 4049352 (1977-09-01), Lardon et al.
patent: 4166784 (1979-09-01), Chapin et al.
patent: 4208240 (1980-06-01), Lasto
patent: 4381894 (1983-05-01), Gogol, Jr. et al.
patent: 4456379 (1984-06-01), Schumann et al.
patent: 4469713 (1984-09-01), Schwiecker et al.
patent: 4478173 (1984-10-01), Doehler
patent: 4711790 (1987-12-01), Morishige
patent: 4894132 (1990-01-01), Tanaka
patent: 5009485 (1991-04-01), Hall
patent: 5032435 (1991-07-01), Biefeld et al.
patent: 5154810 (1992-10-01), Kamerling et al.
Patent Abstracts of Japan, vol. 013, No. 125 (P-847), 28 Mar. 1989 & JP-A-63 295907 (Mitsubishi Electric Corp.) 2 Dec. 1988.
Patent Abstracts of Japan, vol. 014, No. 349 (P-1084), 27 Jul. 1990 & JP-A-02 124406 (Mitsubishi Electric Corp.) 11 May 1990.
Patent Abstracts of Japan, vol. 011, No. 249 (E-532), 13 Aug. 1987 & JP-A-62 062513 (Fujitsu Ltd.) 19 Mar. 1987.
Patent Abstracts of Japan, vol. 014, No. 128 (P-1019), 9 Mar. 1990 & JP-A-01 320408 (Nippon Steel Corp.) 26 Dec. 1989.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for monitoring the deposition rate of films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for monitoring the deposition rate of films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for monitoring the deposition rate of films will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1857917

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.