Method and apparatus for monitoring plasma chamber condition by

Details Method and apparatus for monitoring plasma chamber condition by Method and apparatus for monitoring plasma chamber condition by

1997-08-20

2000-02-15

Wong, Don

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 395 23, 315134, G06F 1518, H01L 2100

Patent

active

060248319

ABSTRACT:
A method and apparatus for monitoring condition of the plasma of a plasma process during processing is disclosed. A spectrum detector (12) detects the intensity of a predetermined wavelength of radiation produced by the plasma process. The output of the spectrum detector is sampled, filtered, and normalized. A parameter calculator (20) calculates a parameter such as velocity or acceleration of the intensity. The calculated parameter is compared to a predetermined threshold. If the parameter exceeds the predetermined threshold, an error condition is indicated.

REFERENCES:
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patent: 4888199 (1989-12-01), Felts et al.
patent: 5578161 (1996-11-01), Auda
patent: 5664066 (1997-09-01), Sun et al.
patent: 5738756 (1998-04-01), Liu
patent: 5759424 (1998-06-01), Imatake et al.

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