Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2005-08-09
2005-08-09
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C438S014000, C356S237200, C324S750010
Reexamination Certificate
active
06927077
ABSTRACT:
An apparatus for measuring contamination of a semiconductor substrate includes a chuck for loading a substrate, a position detection means for recognizing a front surface of the loaded substrate to obtain position data of a portion of the substrate to be measured, a first driving part for moving the chuck in accordance with the position data to measure a rear portion of the substrate, and a surface measurement means disposed under the chuck for selectively measuring metal contamination of the substrate at the rear portion of the substrate. In operation, the substrate is loaded onto a chuck, position data of a portion of the substrate to be measured is obtained by recognizing patterns formed on the substrate, the substrate is then moved in accordance with the position data to measure a rear portion of the substrate, and metal contamination is selectively measured at the rear portion of the substrate.
REFERENCES:
patent: 5087876 (1992-02-01), Reiss et al.
patent: 5963315 (1999-10-01), Hiatt et al.
patent: 6627466 (2003-09-01), Berman et al.
patent: 9-139342 (1997-06-01), None
Choi Sun-Yong
Chon Sang-Mun
Eom Tae-Min
Jun Chung-Sam
Kim Park-Song
Lee & Morse P.C.
Pert Evan
Samsung Electronics Co,. Ltd.
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