Method and apparatus for inspecting a wafer surface

Details Method and apparatus for inspecting a wafer surface Method and apparatus for inspecting a wafer surface

2007-12-18

2007-12-18

Nguyen, Sang H. (Department: 2886)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237500, C356S237200

Reexamination Certificate

active

10877684

ABSTRACT:
In a method and an apparatus for inspecting a wafer surface, a wafer is loaded into a chamber. An incident light including a first light for sensing a vertical position of the wafer and a second light for inspecting the wafer surface is irradiated onto the wafer. The first light is reflected on an inspection region or a next inspection region of the wafer and is detected to control a wafer position. The second light is scattered on the inspection region and is detected to inspect the wafer surface of the inspection region. Position information of a wafer is examined and a position of the wafer is adjusted before inspecting a surface of inspection region of a wafer so as to enable accurate inspection of the wafer surface.

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