Method and apparatus for high-speed interconnect testing

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

714731, 327144, G01R 3128

Patent

active

060000511

ABSTRACT:
A method of testing high speed interconnectivity of circuit boards having components operable at a high speed system clock, employing an IEEE 1149.1 standard test method in which test data is shifted into and from the components at the rate of a test clock during Shift.sub.-- In and Shift.sub.-- Out operations, and having an Update operation and a Capture operation between the Shift.sub.-- In and Shift.sub.-- Out operations, the components including a first group of components capable of performing the Update and Capture operations at the rate of the Test Clock only and a second group of components capable of performing the Update and Capture operations at the rate of the system clock, the method comprising the steps of performing the Shift.sub.-- In operation in all of the components concurrently at the rate of the Test Clock; performing the Update and Capture Operations in the first group of components at the rate of the Test Clock; and performing the Update and Capture Operations in the second group of components at the rate of the system Clock. The method employs a novel integrated circuit, test controller and boundary scan cells.

REFERENCES:
patent: 4494066 (1985-01-01), Goel et al.
patent: 5109190 (1992-04-01), Sakashita et al.
patent: 5463338 (1995-10-01), Yurash
patent: 5774476 (1998-06-01), Pressly et al.
Y. Zorian et al., "An Effective Multi-Chip BIST Scheme", Journal of Electronic Testing: Theory and Applications 10, (1997), pp. 87-95.
T.M. Storey et al., "A Test Methodology for High Performance MCMs", Journal of Electronic Testing: Theory and Applications 10, (1977), pp. 109-118.
C. Maunder et al., "Boundary-Scan, A framework for structured design-for-test", IEEE 1987 International Test Conference, Paper 30.1, (1987), pp. 714-723.
IEEE Standard Test Access Port and Boundary-Scan Architecture, IEEE Standard 1149.1-1990 (Includes IEEE Standard 1149.1a-1993) pp. 1-1 to 1-5; 5-1 to 5-16.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for high-speed interconnect testing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for high-speed interconnect testing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for high-speed interconnect testing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-836840

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.