Metal resistor, resistor material and method

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate

Reexamination Certificate

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C438S382000, C438S384000, C438S385000, C438S210000, C438S190000, C438S238000, C438S329000, C438S330000, C438S331000, C438S332000, C438S508000, C438S508000, C438S508000, C257S758000, C257S532000, C257S328000

Reexamination Certificate

active

07314786

ABSTRACT:
A metal resistor and resistor material and method of forming the metal resistor are disclosed. The metal resistor may include an infused metal selected from the group consisting of: copper (Cu) infused with at least one of silicon (Si), nitrogen (N2), carbon (C), tantalum (Ta), titanium (Ti) and tungsten (W), and aluminum infused with at least one of silicon (Si), nitrogen (N2), carbon (C), tantalum (Ta), titanium (Ti) and tungsten (W). The method is less complex than conventional processes, allows control of the resistance by the amount of infusion material infused, and is compatible with conventional BEOL processes.

REFERENCES:
patent: 6083785 (2000-07-01), Segawa et al.
patent: 6207560 (2001-03-01), Lee
patent: 6232042 (2001-05-01), Dunn et al.
patent: 7078305 (2006-07-01), Olson
patent: 7078786 (2006-07-01), Racanelli et al.
patent: 7122898 (2006-10-01), Yang et al.
patent: 2003/0151116 (2003-08-01), Cabral et al.
patent: 2004/0027234 (2004-02-01), Hashimoto et al.
patent: 2006/0138401 (2006-06-01), Yu et al.
US 5,485,738, 01/1996, Morris (withdrawn)

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