Metal gate structure and method of manufacturing same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S229000, C438S585000, C438S508000, C438S508000

Reexamination Certificate

active

07875519

ABSTRACT:
A method of manufacturing a metal gate structure includes providing a substrate (110) having formed thereon a gate dielectric (120), a work function metal (130) adjacent to the gate dielectric, and a gate metal (140) adjacent to the work function metal; selectively forming a sacrificial capping layer (310) centered over the gate metal; forming an electrically insulating layer (161) over the sacrificial capping layer such that the electrically insulating layer at least partially surrounds the sacrificial capping layer; selectively removing the sacrificial capping layer in order to form a trench (410) aligned to the gate metal in the electrically insulating layer; and filling the trench with an electrically insulating material in order to form an electrically insulating cap (150) centered on the gate metal.

REFERENCES:
patent: 4752505 (1988-06-01), Arac
patent: 4920403 (1990-04-01), Chow et al.
patent: 5937303 (1999-08-01), Gardner et al.
patent: 6184129 (2001-02-01), Hwang et al.
patent: 6222279 (2001-04-01), Mis et al.
patent: 6429126 (2002-08-01), Herner et al.
patent: 6939764 (2005-09-01), Chen et al.
patent: 7253049 (2007-08-01), Lu et al.
patent: 7381597 (2008-06-01), Lin
patent: 7544594 (2009-06-01), Change
patent: 2004/0175910 (2004-09-01), Pan et al.
patent: 2005/0215038 (2005-09-01), Hall et al.
patent: 2006/0040482 (2006-02-01), Yang et al.
patent: 2006/0199321 (2006-09-01), Lo et al.
patent: 2006/0237821 (2006-10-01), Lee et al.
patent: 2009/142982 (2009-11-01), None
Creighton, J. R., “A Mechanism for Selectivity Loss during Tungsten CVD”, J. Electrochem. Soc., vol. 136 No. 1, Jan. 1989, pp. 271-276.
Itoh, H., et al., “Machanism for Initial Stage of Selective Tungsten Growth Employing a WF6 and SiH4 Mixture”, Japanese Journal of Applied Physics, vol. 30, No. 7, Jul. 1991, p. 152-1529.
Brown, D.M., et al., “Selective CVD Tungsten via Plugs for Multilevel Metalization”, IEEE, IEDM 91, 1986, 6 pgs.
Bradbury, D.R., et al., “Selective CVD Tungsten as an Alternative to Blanket Tungsten for Submicron Plug Applications on VLSI Circuits”, 1991, IEEE, IEDM 91, pp. 273-276.
Mehta, S., et al., “Selective CVD Tungsten in VLSI Contract Technology”, Intel Technology Journal, pp. 22-28.
Gorczyca, T. B., et al., “Selective Tungsten CVD in a Hot Walled Reactor by Silane Reduction of WF6”, Sep. 1989, pp. 2765-2766.
Kobayashi, N., et al., “Study on Mechanism of Selective Chemical Vapor Deposition of Tungsten Using in situ Infrared Spectroscopy and Auger Electron Spectroscopy”, J. Appl. Phys. 69 (2), Jan. 15, 1991, pp. 1013-1019.
Chang, K., et al., “Characteristics of Selective Chemical Vapor Deposition of Tungsten on Aluminum with a Vapor Phase Precleaning Technology”, J. Electrochem Soc., vol. 144, No. 1, Jan. 1997, pp. 251-259.
Kang, S., et al., “Application of Selective CVD Tungsten for Low Contact Resistance Via Filing to Aluminum Multilayer Interconnection”, Journal of Electronic Materials, vol. 17, No. 3, 1988, pp. 213-216.
“Transistor, Method of Manufacturing Same, Etchant for Use During Manufacture of Same, and System Containing Same”, Willy Rachmady, et al., U.S. Appl. No. 11/607,549, filed: Nov. 30, 2006.
International Search Report and Written Opinion received for PCT Application No. PCT/US2009/043898, mailed on Dec. 24, 2009, 11 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Metal gate structure and method of manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal gate structure and method of manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal gate structure and method of manufacturing same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2726318

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.