MEMS sensor suite on a chip

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal

Reexamination Certificate

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C438S050000, C257S414000

Reexamination Certificate

active

07368312

ABSTRACT:
The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

REFERENCES:
patent: 2005/0160814 (2005-07-01), Vaganov et al.
Gary K. Fedder, Qi Jing, NODAS 1.3—Nodal Design of Actuators and Sensors, Oct. 27-28, 1998, BMAS '98: IEEE/VIUF Int. Workshop on Behavioral Modeling and Simulation, Orlando, FL, USA.
Mark Lemkin, Bernhard E. Boser, A Three-Axis Micromachined Accelerometer with a CMOS Position-Sense Interface and Digital Offset-Trim Electronics, IEEE Journal of Solid-State Circuits, vol. 34, No. 4, Apr. 1999.

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