Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2008-05-06
2008-05-06
Rose, Kiesha (Department: 4176)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S050000, C257S414000
Reexamination Certificate
active
07368312
ABSTRACT:
The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.
REFERENCES:
patent: 2005/0160814 (2005-07-01), Vaganov et al.
Gary K. Fedder, Qi Jing, NODAS 1.3—Nodal Design of Actuators and Sensors, Oct. 27-28, 1998, BMAS '98: IEEE/VIUF Int. Workshop on Behavioral Modeling and Simulation, Orlando, FL, USA.
Mark Lemkin, Bernhard E. Boser, A Three-Axis Micromachined Accelerometer with a CMOS Position-Sense Interface and Digital Offset-Trim Electronics, IEEE Journal of Solid-State Circuits, vol. 34, No. 4, Apr. 1999.
Elliott Robert Faye
Kranz Michael Scott
Reiner Philip John
Whitley Michael Ray
Williams Marty Ray
Greenberg & Traurig, LLP
McQuade Paul F.
Morgan Research Corporation
Rose Kiesha
Trice Kimberly
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