Memory device testing apparatus

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing

Reexamination Certificate

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C714S718000, C714S743000

Reexamination Certificate

active

06502216

ABSTRACT:

This patent application claims priority based on a Japanese patent application, H10-368154 filed on Dec. 24, 1998, the contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a memory device testing apparatus for testing a memory device. In particular, the present invention relates to a memory device testing apparatus comprising a failure analysis memory unit that can change the dividing method of an address space of a data storing memory.
2. Description of the Related Art
FIG. 1
shows a block diagram of a conventional memory
10
in a failure analysis memory unit for storing fail data output from a comparator. This memory
10
has a data storing memory
12
, a compact memory
14
, a compact memory address generator
16
, and a bus controller
18
. The data storing memory
12
has at least two memories and has the same word number and bit size as the entire memory under test. The compact memory
14
has an extremely small capacity compared to the data storing memory
12
. The data storing memory
12
is divided into a plurality of partial address spaces for future failure analysis of the memory under test. The compact memory
14
has a plurality of addresses, each corresponding to a plurality of the partial address spaces of the data storing memory
12
.
In the memory device testing apparatus, fail data, which is output from the comparator, and an address signal, which indicates the address for storing the fail data, are input to the memory
10
. A lower address signal
20
constituted by a lower bit of the address signal is input to the address pin (AD) and the compact memory address generator
16
. Furthermore, an upper address signal
22
constituted by an upper bit of the address signal is input to the chip select pin (CS) of the data storing memory
12
and the compact memory address generator
16
. Using the upper address signal
22
, one of a plurality of memories, which constitutes the data storing memory
12
, is selected. The compact memory address generator
16
generates an address which accesses the compact memory
14
based on the lower address signal
20
and the upper address signal
22
. This address corresponds to the partial address space of the data storing memory
12
.
A write control signal
24
is input to the write enable pin (WE) of the data storing memory
12
and the compact memory
14
. The bus controller
18
outputs the fail data signal
26
to the data storing memory
12
and the data input pin (DI) of the compact memory
14
. In the conventional memory
10
, by inputting the above signals to the data storing memory
12
and the compact memory
14
, the fail data is input to the data storing memory
12
, and the failure information is written into the compact memory
14
. The failure information indicates that there is a failure spot in the partial address space.
Recently, high-capacity, highly integrated memory devices have been developed. The memory to be tested by the memory device testing apparatus may often be a newly developed bulk memory. If the memory device as a whole is determined a failure when there is even just one failed cell inside the high-capacity, highly integrated memory device, the yield factor is very low. Therefore, there is a method of replacing the failed cell with a spare memory cell by providing the memory device with spare cells beforehand. According to this method, by replacing the failed cell with a spare cell during the manufacturing process of the memory device, a memory device that is not considered a complete failure can be manufactured.
As one of the means of replacement of the failed cell using the above method, a memory failure relief analyzer is provided on the memory device testing apparatus. This memory failure relief analyzer retrieves the address of the failed cell in the memory device and finds a solution such designation of the spare cell to be used for replacing the retrieved failed cell. The memory failure relief analyzer receives the fail data from the data storing memory
12
based on the failure data stored in the compact memory
14
of the failure analysis memory unit. If the failure information is stored in the address of the compact memory
14
, the memory failure relief analyzer receives the data in the corresponding partial address space of the data storing memory
12
. Contrary to this, if the failure information is not stored in the address of the compact memory
14
, the memory failure relief analyzer does not receive the data in the corresponding partial address space of the data storing memory
12
.
The failure analysis memory unit and the memory failure relief analyzer can exist as different units and can be connected to each other by a cable. By using the information stored in the compact memory
14
, unnecessary data is not transferred. This reduces the data transfer time due to the cable provided between the failure analysis memory unit and the memory failure relief analyzer.
According to the configuration of the conventional memory
10
shown in
FIG. 1
, the fail data can be written into the compact memory
14
only when the memory under test is actually being tested. Therefore, when changing the dividing method of the address space of the data storing memory
12
and writing the failure data for every partial address space in the compact memory
14
, the memory under test has to be tested repeatedly with each change in the settings of the compact memory address generator
16
. Generally, the checks on writing/reading for each memory cell and the checks for interference with other nearby memory cells are carried out during the testing of the memory itself. Therefore, if the number of addresses in the memory under test is N, the time for testing the memory under test is proportional to approximately the square of N.
Depending on the dividing method of the address space of the data storing memory
12
, the failure information will be stored in many or all of the addresses in the compact memory
14
. In this situation, all the memory data stored in the data storing memory
12
is transferred to the memory failure relief analyzer. Therefore, the data transfer time from the failure analysis memory unit to the memory failure relief analyzer cannot be reduced. It is therefore less useful to provide the compact memory
14
in the memory
10
.
Furthermore, according to the configuration of the conventional memory
10
, the memory under test has to be tested again to change the dividing method of the address space of the data storing memory
12
, and to write the failure information of every new partial address space into the compact memory
14
. Because this re-testing takes so much time, it is not the preferred method for changing the dividing method of address space and re-generating the data of the compact memory
14
.
Therefore, it is desired to provide a failure analysis memory unit which can change the dividing method of the address space of the data storing memory
12
without re-testing of the memory device testing apparatus. Furthermore, for a purpose other than the memory failure relief, by making the dividing method of the address space changeable, the memory device testing apparatus can be highly versatile with wider applications.
SUMMARY OF THE INVENTION
Therefore, it is an object of the present invention to provide a memory device testing apparatus having a failure analysis memory unit which overcomes the above issues in the related art. This object is achieved by combinations described in the independent claims. The dependent claims define further advantageous and exemplary combinations of the present invention.
According to the first aspect of the present invention, a memory device testing apparatus for testing a memory device can be provided. The memory device testing apparatus comprises: a pattern generator which generates an address signal that indicates an address of the memory device, an input pattern signal to be input to the memory device, and an expectation value pattern signal to

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