Masking methods and etching sequences for patterning...

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Reexamination Certificate

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C430S311000, C430S313000, C430S316000, C430S317000, C438S653000, C216S067000, C216S075000

Reexamination Certificate

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06919168

ABSTRACT:
A method of etching a noble metal electrode layer disposed on a substrate to produce a semiconductor device including a plurality of electrodes separated by a distance equal to or less than about 0.35 μm and having a noble metal profile equal to or greater than about 80°. The method comprises heating the substrate to a temperature greater than about 150° C., and etching the noble metal electrode layer by employing a high density inductively coupled plasma of an etchant gas comprising a gas selected from the group consisting of nitrogen, oxygen, a halogen (e.g., chlorine), argon, and a gas selected from the group consisting of BCl3, HBr, and SiCl4mixtures thereof. Masking methods and etching sequences for patterning high density RAM capacitors are also provided.

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