Manufacturing process for a flash memory and flash memory...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S259000, C438S294000, C257S315000, C257S623000

Reexamination Certificate

active

10763044

ABSTRACT:
The invention relates to a production process for a flash memory from a semi-conductor substrate fitted with at least two adjacent rows of precursor stacks of floating gate transistors, the precursor stacks being at least partially covered by a protective resin and being separated by a formation zone for a source line. The process includes forming a trench in the formation zone for the source line by an attack of this zone and of the protective resin. The result of the attack step includes a deposit of residue from the resin below the precursor stacks. The residue deposit is removed. A source line is implanted in the formation zone below the precursor stacks. This process enables the time needed for erasing the memory to be reduced.

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S. Wolf and R.N. Tauber ,“Silicon Processing for the VLSI Era”, 1986, Lattice press, vol. 1, p. 564-565.
French Preliminary Search Report dated Nov. 6, 2003 for French Application No. 0300681.

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