Manufacturing method for semiconductor device and...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S478000, C438S479000, C438S758000, C257SE21010

Reexamination Certificate

active

07923355

ABSTRACT:
A manufacturing method for a semiconductor device includes retaining a wafer in a reaction chamber, supplying first process gas including source gas and second process gas containing H2or inert gas onto the wafer in a rectified state alternately in a predetermined cycle, rotating the wafer, and heating the wafer to form a film on the wafer.

REFERENCES:
patent: 2003/0129811 (2003-07-01), Raaijmakers et al.
patent: 2004/0224089 (2004-11-01), Singh et al.
patent: 2006/0286776 (2006-12-01), Ranish et al.
patent: 2007/0066082 (2007-03-01), Schauer et al.
patent: 2007/0232031 (2007-10-01), Singh et al.
patent: 11-67675 (1999-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Manufacturing method for semiconductor device and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method for semiconductor device and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for semiconductor device and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2709517

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.