Manufacture of MEMS structures in sealed cavity using...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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Reexamination Certificate

active

07008812

ABSTRACT:
The disclosed fabrication methodology addresses the problem of creating low-cost micro-electro-mechanical devices and systems, and, in particular, addresses the problem of delicate microstructures being damaged by the surface tension created as a wet etchant evaporates. This disclosure demonstrates a method for employing a dry plasma etch process to release encapsulated microelectromechanical components.

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Gianchandani, Y.B., Kim, H., Shinn, M., Ha, B., Lee, B., Najafi, K. and Song, C., “A MEMS-First Fabrication Process for Integrating CMOS Circuits with Polysilicon Microstructures”, 1998 IEEE, pp. 257-262.
Kniffin, Margaret L., Shah, Mahesh, “Packaging for silicon Micromachined Accelorometers”, The International Society for Hybrid Microelectronics, vol. 19, No. 1, First Quarter 1996, pp.75-86.
Gianchandani, Y.B., Kim, H., Shinn, M., Ha, B., Lee, B., Najafi, K. and Song, C., “A MEMS-First Fabrication Process for Integrating CMOS Circuiuts with Polysilicon Microstructures”, 1998 IEEE, pp. 257-262.
Kniffin, Margaret L. Shah, Mahesh, “Packaging for Silicon Micromachined Accelerometers”, The International Society for Hybrid Microelectronics, vol. 19, No. 1, First Quarter 1996, pp. 75-86.

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