Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-03-07
2006-03-07
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
Reexamination Certificate
active
07008812
ABSTRACT:
The disclosed fabrication methodology addresses the problem of creating low-cost micro-electro-mechanical devices and systems, and, in particular, addresses the problem of delicate microstructures being damaged by the surface tension created as a wet etchant evaporates. This disclosure demonstrates a method for employing a dry plasma etch process to release encapsulated microelectromechanical components.
REFERENCES:
patent: 5083857 (1992-01-01), Hornbeck
patent: 5285131 (1994-02-01), Muller et al.
patent: 5314572 (1994-05-01), Core et al.
patent: 5493177 (1996-02-01), Muller et al.
patent: 5573679 (1996-11-01), Mitchell et al.
patent: 5578976 (1996-11-01), Yao
patent: 5683591 (1997-11-01), Offenberg
patent: 5798283 (1998-08-01), Montague et al.
patent: 5834333 (1998-11-01), Seefeldt et al.
patent: 6238580 (2001-05-01), Cole et al.
patent: 6441451 (2002-08-01), Ikeda et al.
patent: 0 624 900 (1994-04-01), None
patent: 0624900 (1994-11-01), None
The article to Storment, et al. entitled, “Flexible dry-released process for aluminum electrostatic actuators,” Journal of Microelectromechanical Systems, 3(3), Sep. 1994, IEEE, pp. 90-96.
Wolf, et al. Silicon Processing for the VLSI Era, vol. 1-Process Technology, Lattice Press: Sunset Beach CA, 1986, pp. 428-429.
G.K. Fedder, S. Santhanam, M.L. Reed, S.C. Eagle, D.F. Guillou, M.S.-C Lu, and L. Richard Carley, Laminated High-Aspect-Ratio Microstructures in a Conventional CMOS Process, 9th IEEE International Workshop on Micro Electro Mechanical Systems, San Diego, CA USA, Feb. 11-15, 1996.
G.K. Fedder, S. Santhanam, M.L. Reed, S.C. Eagle, D.F. Guillou, M.S.—C. Lu and L. Richard Carley, Laminated High-Aspect-Ratio Microstructures in a Conventional CMOS Process, Sensors & Actuators A, vol. 57, No. 2, Mar. 1997, pp. 103-110.
G.K. Fedder, Integrated Microelectromechanical Systems in Conventional CMOS, 1997 IEEE Int. Symposium on Circuits and Systems, Hong Kong, Jun. 9-12, 1997, v. 4, pp. 2821-2824.
G.K. Fedder, CMOS-Based Microstructures with Lateral Electrostatic Actuation, 1996 Sensors Expo Philadelphia Conf., Philadelphia, PA Oct. 22-24, 1996, pp. 131-135.
D.A. Koester, R. Mahadevan, B. Hardy and K. Markus, MUMPs Design Handbook, Cronos Integrated Microsystems, N.C., rev. 3, Oct. 1994.
J.H. Smith, S. Montague, J.J. Sniegowski, J.R. Murray and P.J. McQhorter, Embedded Micromechanical Devices for the Monolithic Integration of MEMS with CMOS, IEDM, 1995, pp. 609-612.
M. Parameswaran, A.M. Robinson, D.L. Blackburn, M. Gaitan and J. Geist, Micromachined Thermal-Radiation Emitter from a Commercial CMOS Process, 1991 IEEE, vol. 12, No. 2, pp. 57-59.
X.C. Jin, I. Ladabaum, B.T. Khuri-Yakub, Surface Micromachined Capacitive Ultrasonic Immersion Transducers, IEEE MEMS Conference, Heidelberg Germany, Jan. 1998.
Q.B. Zou, Z.M. Tan, Z.F. Wang, M.K. Lim, R.M. Lin, S. Yi and Z.J. Li, Design and Fabrication of a Novel Integrated Floating-Electrode-Electret-Microphone (FEEM), IEEE MEMS Conference, Heidelberg Germany, Jan. 1998.
Gianchandani, Y.B., Kim, H., Shinn, M., Ha, B., Lee, B., Najafi, K. and Song, C., “A MEMS-First Fabrication Process for Integrating CMOS Circuits with Polysilicon Microstructures”, 1998 IEEE, pp. 257-262.
Kniffin, Margaret L., Shah, Mahesh, “Packaging for Silicon Micromachined Accelerometers”, The International Society for Hybrid Microelectronics, vol. 19, No. 1, First Quarter 1996, pp. 75-86.
G.K. Fedder, S. Santhanam, M.L. Reed, S.C. Eagle. D.F. Guillou, M.S.-C LU, and L. Richard Carley, Laminated High-Aspect-Ratio Microstructures in a Conventional CMOS Process, 9th IEEE. International Workshop on Micro Electro Mechanical Systems, San Diego, CA USA, Feb. 11-15, 1996
G.K. Fedder, S. Santhanam, M.L. Reed, S.C. Eagle. D.F. Guillou, M.S.-C LU, and L. Richard Carley, Laminated High-Aspect-Ratio Microstructures in a Conventional CMOS Process, Sensors & Actuators A, vol. 57, No. 2, Mar. 1997, pp. 103-110.
G.K. Fedder, Integrated Microelectromechanical Systems in Conventional CMOS, 1997 IEEE Int. Symposium on Circuits and Systems, Hong Kong, Jun. 9-12, 1997, v. 4, pp. 2821-2824.
G.K. Fedder, CMOS-Based Microstructures with Lateral Electrostatic Actuation, 1996 Sensors Expo Philadelphia Conf., Philadelphia., PA Oct. 22-24, 1996, pp. 131-135.
D.A. Koester, R. Mahadevan, B. Hardy and K. Markus MUMPs Design Handbook, Cronos Integrated Microsystems, N.C., rev. 3, Oct. 1994.
J.H Smith, S. Montague, J.J. Sniegowski, J.R. Murray and P.J. McQhorter, Embedded Micromechanical Devices for the Monolithic Integration of MEMS with CMOS, IEDM, 1995, pp. 609-612.
M. Parameswaran, A.M. Robinson, D.L. Blackburn, M. Gaitan and J. Geist, Micromachined Thermal-Radiation Emitter from a Commerical CMOS Process, 1991 IEEE, vol. 12, No. 2, pp. 57-59.
X.C. JIN, I. LADABAUM, B.T. KHURI-YAKUB, Surface Micromachined Capacitive Ultrasonic Immersion Transducers, IEEE MEMS Conference, Heidelberg Germany, Jan. 1998.
Q.B. ZOU, Z.M. TAN, Z.F. WANG, M.K. LIM, R.M. LIN, S. YI and Z.J. LI, Design and Fabrication of a Novel Integrated Floating-Electrode-Electret-Microphone (FEEM), IEEE MEMS Conference, Heidelberg Germany, Jan. 1998.
Gianchandani, Y.B., Kim, H., Shinn, M., Ha, B., Lee, B., Najafi, K. and Song, C., “A MEMS-First Fabrication Process for Integrating CMOS Circuits with Polysilicon Microstructures”, 1998 IEEE, pp. 257-262.
Kniffin, Margaret L., Shah, Mahesh, “Packaging for silicon Micromachined Accelorometers”, The International Society for Hybrid Microelectronics, vol. 19, No. 1, First Quarter 1996, pp.75-86.
Gianchandani, Y.B., Kim, H., Shinn, M., Ha, B., Lee, B., Najafi, K. and Song, C., “A MEMS-First Fabrication Process for Integrating CMOS Circuiuts with Polysilicon Microstructures”, 1998 IEEE, pp. 257-262.
Kniffin, Margaret L. Shah, Mahesh, “Packaging for Silicon Micromachined Accelerometers”, The International Society for Hybrid Microelectronics, vol. 19, No. 1, First Quarter 1996, pp. 75-86.
Dolan Jennifer M
Greenberg & Traurig, LLP
IC Mechanics Inc.
Jr. Carl Whitehead
LandOfFree
Manufacture of MEMS structures in sealed cavity using... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacture of MEMS structures in sealed cavity using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacture of MEMS structures in sealed cavity using... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3587190