Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Reexamination Certificate
2008-10-16
2010-11-23
Meeks, Timothy H (Department: 1715)
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
C427S569000, C118S7230ER
Reexamination Certificate
active
07838086
ABSTRACT:
A method for processing a substrate is provided. The substrate is placed in a process chamber. A gas is provided from a gas source to the process chamber. A plasma is generated from the gas in the process chamber. The gas flows through a gap adjacent to at least one confinement ring to provide physical confinement of the plasma. Magnetic confinement of the plasma is provided to enhance the physical confinement of the plasma.
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Dhindsa Rajinder
Hudson Eric A.
Keil Douglas L.
Kim Ji Soo
Lenz Eric H.
Beyer Law Group LLP
Lam Research Corporation
Meeks Timothy H
Ripple Collette
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