LGA fixture for indium assembly process

Details LGA fixture for indium assembly process LGA fixture for indium assembly process

2007-08-14

2007-08-14

Clark, Jasmine (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S455000, C438S117000, C438S122000, C257S704000, C257S710000, C257SE23180, C257SE21500

Reexamination Certificate

active

11381089

ABSTRACT:
An integrated circuit lid fixture and methods of using the same are provided. In one aspect, an integrated circuit lid fixture is provided that includes a base that has a plurality of pillars. Each of the plurality of pillars has a surface for supporting a substrate that may be removably seated thereon. The surfaces of the plurality of pillars have a first footprint at least as large as a footprint of the substrates to be placed thereon. A plate is provided for applying a compressive force to an integrated circuit lid positioned on any of the substrates removably seated on the pillars.

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