Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Inventor
active
Inspection of underfill in integrated circuit package
LGA fixture for indium assembly process
Methods and fixture for coupling a lid to a support substrate
No associations
LandOfFree
Keng Sang Cha does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Keng Sang Cha, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Keng Sang Cha will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-3106662