Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
Inventor
active
Inspection of underfill in integrated circuit package
LGA fixture for indium assembly process
Methods and fixture for coupling a lid to a support substrate
Void reduction in indium thermal interface material
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Profile ID: LFUS-PAI-P-2293715