Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-01-10
2006-01-10
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000, C257S670000, C257S787000
Reexamination Certificate
active
06984880
ABSTRACT:
A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).
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Notice of Reasons of Rejection (Dated Jun. 24, 2003) Corresponds to JP 2001-037484.
Notice of Reasons of Rejection (Dated Jun. 24, 2003) Corresponds to JP 2001-037496.
Korean Office Action Dated Mar. 21, 2003.
Fukuda Toshiyuki
Kawai Fumihiko
Koichi Masanori
Minamio Masanori
Oga Akira
Flynn Nathan J.
Mandala Jr. Victor A.
Nixon-Peabody, LLP
Studebaker Donald R.
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