4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Fumihiko Kawai

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Lead frame with multiple rows of external terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframe, resin-molded semiconductor device including the...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Leadframe, resin-molded semiconductor device including the...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for manufacturing a resin-sealed semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Resin-encapsulated semiconductor device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2645730

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