4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Keng Kiat Lau

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active

Large die package and method for the fabrication thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframe with encapsulant guide and method for the...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3078215

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