4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Yap Kah Eng

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Ball grid array interposer, packages and methods

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Interposers with receptacles for receiving semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2794853

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