4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Setho Sing Fee

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Ball grid array interposer, packages and methods

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Enhanced BGA grounded heatsink

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Enhanced BGA grounded heatsink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader hole pin 1 identifier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Heat spreader hole pin 1 identifier

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2214599

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