Interferometric endpoint determination in a substrate...

Details Interferometric endpoint determination in a substrate... Interferometric endpoint determination in a substrate...

2007-12-11

2007-12-11

Kackar, Ram N. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C156S345240, C438S007000, C438S014000, C438S710000, C204S192330, C204S298320

Reexamination Certificate

active

10286402

ABSTRACT:
In determining an endpoint of etching a substrate, light that is directed toward the substrate is reflected from the substrate. A wavelength of the light is selected to locally maximize the intensity of the reflected light at an initial time point of the etching process. The reflected light is detected to determine an endpoint of the substrate etching process.

REFERENCES:
patent: 5405488 (1995-04-01), Demitrios et al.
patent: 5658418 (1997-08-01), Coronel et al.
patent: 5885472 (1999-03-01), Miyazaki et al.
patent: 6081334 (2000-06-01), Grimbergen et al.
patent: 6113733 (2000-09-01), Eriguchi et al.
patent: 6406641 (2002-06-01), Golzarian
patent: 6406924 (2002-06-01), Grimbergen et al.
patent: 2003/0043383 (2003-03-01), Usui et al.
patent: 2000 292129 (2001-02-01), None
patent: WO-0124235 (2001-04-01), None
patent: WO-0235586 (2002-05-01), None
Bosch-Charpenay S et al: “Real-Time Etch-Depth Measurements of MEMS Devices” Journal of Microelectromechanical Systems, IEEE Inc. New York, vol. 11, No. 2, Apr. '02, pp. 111-117.
“In Situ Etch Rate Detecting Technique” IBM Technical Disclosure Bulletin, IBM Corp. New York, vol. 28, No. 9, Feb. 1986 pp. 3952-3954.
Haverflag M et al: “In Situ Ellipsometry and Reflectometry During Etching of Patterned Surfaces”: Journal of Vac Sci and Tech: PT.B; NY, V.10, N.06, Jan. 11, 1992.
European Search Report dated Feb. 24, 2004. European Patent Office, P.B. 5818-Patentlaan 2, 2280 HV Rijswijk (ZH).

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