4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Jack Arthur Varcoe

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Interconnection of a carrier substrate and a semiconductor devic

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Interconnection of a carrier substrate and a semiconductor devic

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Method of making electronic package assembly with protective enc

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-1086569

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