Integrated circuit package with open substrate

Details Integrated circuit package with open substrate Integrated circuit package with open substrate

2009-10-20

2011-10-04

Sefer, A. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257SE29119, C257SE23011, C257SE23067, C438S118000

Reexamination Certificate

active

08030783

ABSTRACT:
A method of manufacturing an integrated circuit package includes: forming a substrate that includes: forming a core layer, forming vias in the core layer, and forming a conductive layer having a predetermined thickness on the core layer and having substantially twice the predetermined thickness in the vias; and forming connections between an integrated circuit die and the conductive layer.

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