Integrated circuit memory devices having multiple...

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Reexamination Certificate

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C365S233100, C365S230060

Reexamination Certificate

active

06487132

ABSTRACT:

RELATED APPLICATION
This application claims the benefit of Korean Patent Application No. 2000-04643, filed Jan. 31, 2000, the disclosure of which is hereby incorporated herein by reference.
FIELD OF THE INVENTION
The present invention relates generally to integrated circuit devices and, more particularly, to integrated circuit memory devices having multiple input/output buses.
BACKGROUND OF THE INVENTION
Integrated circuit memory devices, particularly dynamic access memories (DRAMs), are widely used in electronic systems for storing large volumes of digital information. As electronic systems operate at more rapid processing speeds, however, the access times for reading data from or writing data to a DRAM may become an important parameter when designing a high-performance electronic system.
Various techniques for improving the access time of a DRAM have been developed. According to one method known as “nibble mode,” access time delay may be reduced by constructing a DRAM so that four sequential bits may be accessed rapidly and sequentially. According to another method known as “burst mode,” data bits belonging to a row (e.g., a word line) may be sequentially accessed after a first data bit is accessed. This method may also be referred to as “pull page mode.” After inputting an initial address in burst mode operation, sequential addresses are internally and sequentially generated without inputting new address information to the DRAM. According to the aforementioned methods, the access time of a DRAM may be improved by reducing and/or eliminating the delay time that is needed to fetch an address associated with the respective access of sequential bits.
FIG. 1
is a diagram that illustrates a relationship between a memory cell array and pairs of input/output lines in a conventional dynamic random access memory device. A memory cell array
1
includes a plurality of word lines WLi (i=0−m), a plurality of bit line pairs BLj and BLjB (=0−n), and a plurality of memory cells
10
. A plurality of column select switches
20
are connected between sense amplifiers SA, which are each connected to a bit line pair, and input/output line pairs I/O
0
, I/O
0
B, I/O
1
, I/O
1
B, I/O
2
, I/O
2
B, I/O
3
, and I/O
3
B, as shown. The input/output line pairs I/O
0
, I/O
0
B, I/O
1
, and I/O
1
B are arranged on one side of the memory cell array
1
(i.e., the left side in FIG.
1
), and the input/output line pairs I/O
2
, I/O
2
B, I/O
3
, and I/O
3
B are arranged on another side of the memory cell array
1
(i.e., the right side in FIG.
1
). The input/output line pairs form input/output buses, which may be shared by adjacent memory cell arrays (not shown). That is, the input/output line pairs I/O
0
, I/O
0
B, I/O
1
, and I/O
1
B at the left side of the memory cell array
1
form a left input/output bus, and the input/output line pairs I/O
2
, I/O
2
B, I/O
3
, and I/O
3
B at the right side of the memory cell array
1
form a right input/output bus. The input/output lines comprising the respective data buses transfer 2-bits of data.
Column select lines CSL
0
through CSLk are respectively connected to the column select switches
20
for accessing two bit line pairs via the left input bus and two bit line pairs via the right input bus. Therefore, when a column select line is chosen, 2-bits of data may be transferred through the left and right input/output buses, respectively (i.e., 4-bits of data may be input/output). Corresponding drivers
30
are connected to one end of each input/output line pair on the left side of the memory cell array
1
. Each driver
30
may supply data to be written to the memory cell array
1
through associated input/output line pairs in response to a signal CA
11
B. Similarly, corresponding drivers
30
are connected to one end of each input/output line pair on the right side of the memory cell array
1
. Each driver
30
may supply data to be written to the memory cell array
1
through associated input/output line pairs in response to a signal CA
11
.
In a DRAM having the foregoing input/output structure, the memory cell array may be accessed through the right and left input/output buses simultaneously, or, alternatively, through one of the input/output buses through control of the signals CA
11
and CA
11
B. For example, when the signal CA
11
B is activated and the signal CA
11
is deactivated, the drivers
30
connected to the left input/output bus are selected, while the drivers
30
connected to the right input/output bus are unselected. Conversely, when the signals CA
11
and CA
11
B are activated simultaneously, the drivers
30
connected to the left and right input/output buses are selected at the same time.
The DRAM shown in
FIG. 1
may be operated in a pull page mode as discussed hereinabove. In the pull page mode, all memory cells connected to a selected word line are sequentially accessed. A write operation of the DRAM in pull page mode may be carried out in multiple ways: In one approach, after data are written to memory cells coupled to a selected word line through an input/output bus at one side of the memory cell array
1
, data are then written to memory cells coupled to a selected word line through an input/output bus at the other side of the memory cell array
1
. In another approach, data are written simultaneously to all memory cells coupled to a selected word line through the input/output buses at both sides of the memory cell array
1
. Unfortunately, when performing a pull page mode write operation according to the first approach described above, a problem may arise as follows.
To carry out a write operation through the left input/output bus, the signal CA
11
B is activated and the signal CA
11
is deactivated. As a result, the drivers
30
connected to the left input/output bus are selected and the drivers
30
connected to the right input/output bus are unselected. The selected drivers
30
supply data to be written to the memory cell array
1
through the left input/output bus, which is connected to selected memory cells through column select switches
20
and sense amplifiers SA associated with a first column select line CSL
0
. Data are then sequentially written to the remaining memory cells by sequentially activating remaining column select lines in the same manner as described above.
When the signal CA
11
B is deactivated and the signal CA
11
is activated, the drivers
30
connected to the right input/output bus are selected and the drivers
30
connected to the left input/output bus are unselected. The selected drivers
30
supply data to be written to the memory cell array
1
through the right input/output bus. At this time, the left input/output bus connected to the unselected drivers
30
is maintained in a floating state. Data on the right input/output bus is written to selected memory cells through column select switches
20
and sense amplifiers SA associated with the first column select line CSL
0
. When the first column select line CSL
0
is selected to perform a write operation through the right input/output bus, charges on the left input/output bus, which remain after the write operation has been performed through the left input/output bus, are written to the memory cells identified by the dotted line through column select switches
20
and sense amplifiers SA arranged on the left side of the memory cell array
1
. This unintended corruption of data stored in the memory cell array
1
may be referred to as a “bit line disturbance phenomenon.” As may be seen from
FIG. 1
, when a column select line is selected, the left input/output bus is connected to corresponding memory cells through associated column select switches
20
and sense amplifiers SA, and the right input/output bus is simultaneously connected to corresponding memory cells through associated column select switches
20
and sense amplifiers SA. As a result, data stored in the memory cell array may be corrupted when performing a write operation through one of the input/output buses following the completion of a write operation on the other o

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