Integrated circuit device having an aminopropyltriethoxysilane c

Details Integrated circuit device having an aminopropyltriethoxysilane c Integrated circuit device having an aminopropyltriethoxysilane c

1990-09-24

1993-07-13

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257666, 257671, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

052276619

ABSTRACT:
A lead over chip packaged device that is less prone to package cracking during surface mounting is disclosed. The lead over chip lead frame overlies the active face of a semiconductor circuit. The backside of the semiconductor circuit is covered with an aminopropyltriethoxysilane coating. The aminopropyltriethoxysilane coating promotes adhesion between the backside of the semiconductor circuit and the mold compound used to encapsulate the device. This reduces package cracking resulting from delamination between the inactive face of the chip and the mold compound during reflow solder.

REFERENCES:
patent: 4395527 (1983-07-01), Berger
patent: 4477828 (1984-10-01), Scherer
patent: 4480009 (1984-10-01), Berger
patent: 4499149 (1985-02-01), Berger
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4916519 (1990-04-01), Ward

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