Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1993-11-29
1995-04-11
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257666, 257676, 4284735, 428458, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
054061245
ABSTRACT:
An insulating adhesive tape which comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide, wherein said thermoplastic polymer has a glass transition temperature ranging from 180.degree. C. to 280.degree. C. and an elastic modulus ranging from 10.sup.10 dyne/cm.sup.2 to 10.sup.11 dyne/cm.sup.2 at 25.degree. C., said modulus including a value ranging from 10.sup.2 dyne/cm.sup.2 to 10.sup.9 dyne/cm.sup.2 at a temperature between 250.degree. C. and 300.degree. C.
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patent: 5319241 (1994-06-01), Lim
Abe Kenji
Kiba Shigeo
Kubo Takayuki
Mineta Naoshi
Morita Moritsugu
Crane Sara W.
Mitsui Toatsu Chemicals Inc.
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