4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Naoshi Mineta

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Flexible metal-clad laminates and preparation of the same

Stock material or miscellaneous articles – Structurally defined web or sheet – Including components having same physical characteristic in...
Reexamination Certificate

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Insulating adhesive tape, and lead frame and semiconductor devic

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent

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Profile ID: LFUS-PAI-P-1529700

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