Inspection of underfill in integrated circuit package

Details Inspection of underfill in integrated circuit package Inspection of underfill in integrated circuit package

2005-11-30

2009-11-24

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C438S015000, C438S026000, C438S127000, C700S109000, C700S110000, C257S687000, C257SE23116, C257SE23123, C257SE23129

Reexamination Certificate

active

07622311

ABSTRACT:
In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.

REFERENCES:
patent: 6274389 (2001-08-01), Iida et al.
patent: 6650022 (2003-11-01), Qi et al.
patent: 2007/0069041 (2007-03-01), Quinones et al.
patent: 2006286744 (2006-10-01), None
Machine translation of Specification of JP2006/286744. Human translation requested and will be provided in a later office action.

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