Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2007-04-17
2007-04-17
Kornakov, M. (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C156S345520, C156S345530, C156S345540, C156S345550, C156S345430, C156S345440, C156S345470, C118S724000, C118S725000, C118S728000, C204S298010, C204S298150, C134S902000
Reexamination Certificate
active
10607293
ABSTRACT:
A semiconductor processing chamber having a silicon containing pre-coat is provided. The chamber includes a top electrode in communication with a power supply and a processing chamber defined within a base, a sidewall extending from the base, and a top disposed on the sidewall. The processing chamber has an outlet enabling removal of fluids within the processing chamber and includes a substrate support where an outer surface of the substrate support coated with the removable silicon containing coating, wherein the silicon containing coating is a compound consisting essentially of silicon and one of bromine and chlorine. The chamber includes an inner surface defined by the base, the sidewall and the top, where the inner surface is coated with a removable silicon containing coating.
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Gangadharan Shibu
Singh Harmeet
Ullal Saurabh J.
Kornakov M.
Lam Research Corporation
Martine & Penilla & Gencarella LLP
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