Optics: measuring and testing – By alignment in lateral direction – With registration indicia
Reexamination Certificate
2007-05-15
2007-05-15
Lauchman, Layla G. (Department: 2877)
Optics: measuring and testing
By alignment in lateral direction
With registration indicia
C257S757000, C430S005000, C430S030000, C430S022000
Reexamination Certificate
active
10792147
ABSTRACT:
A semiconductor wafer is disclosed that includes a plurality of fields, including a plurality of alignment fields. Each alignment field includes a plurality of intra-field small scribe lane primary mark (SSPM) overlay mark pairs there around. The SSPM mark pairs allow for in-situ, non-passive intra-field alignment correction. In one embodiment, there may be between two and four alignment fields, and between two and four SSPM mark pairs around each alignment field. The SSPM marks of each mark pair may be extra scribe-lane marks.
REFERENCES:
patent: 6638671 (2003-10-01), Ausschnitt et al.
patent: 6828071 (2004-12-01), Nin
patent: 6906780 (2005-06-01), Smith
patent: 6975974 (2005-12-01), Chien et al.
patent: 7006225 (2006-02-01), Tanaka
Chen Jung Ting
Chou Li-Heng
Ho Grace H.
Hsieh Hung-Chang
Ku Yao-Ching
Lauchman Layla G.
Taiwan Semiconductor Manufacturing Company , Ltd.
Tung & Associates
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