In-situ overlay alignment

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

Reexamination Certificate

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Details

C257S757000, C430S005000, C430S030000, C430S022000

Reexamination Certificate

active

10792147

ABSTRACT:
A semiconductor wafer is disclosed that includes a plurality of fields, including a plurality of alignment fields. Each alignment field includes a plurality of intra-field small scribe lane primary mark (SSPM) overlay mark pairs there around. The SSPM mark pairs allow for in-situ, non-passive intra-field alignment correction. In one embodiment, there may be between two and four alignment fields, and between two and four SSPM mark pairs around each alignment field. The SSPM marks of each mark pair may be extra scribe-lane marks.

REFERENCES:
patent: 6638671 (2003-10-01), Ausschnitt et al.
patent: 6828071 (2004-12-01), Nin
patent: 6906780 (2005-06-01), Smith
patent: 6975974 (2005-12-01), Chien et al.
patent: 7006225 (2006-02-01), Tanaka

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