4. Optics: measuring and testing
  5. By alignment in lateral direction

Hung-Chang Hsieh

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Circuit protecting structure of electronic device

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Reexamination Certificate

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Deep-submicron integrated circuit package for improving...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Dual damascene approach for small geometry dimension

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Dual damascene method employing sacrificial via fill layer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Electrical connector having latching mechanism

Electrical connectors – With coupling movement-actuating means or retaining means in... – Retaining means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-405510

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