Hybrid process for forming metal gates

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE21637, C438S157000

Reexamination Certificate

active

07812414

ABSTRACT:
A semiconductor structure and methods for forming the same are provided. The semiconductor structure includes a first MOS device of a first conductivity type and a second MOS device of a second conductivity type opposite the first conductivity type. The first MOS device includes a first gate dielectric on a semiconductor substrate; a first metal-containing gate electrode layer over the first gate dielectric; and a silicide layer over the first metal-containing gate electrode layer. The second MOS device includes a second gate dielectric on the semiconductor substrate; a second metal-containing gate electrode layer over the second gate dielectric; and a contact etch stop layer having a portion over the second metal-containing gate electrode layer, wherein a region between the portion of the contact etch stop layer and the second metal-containing gate electrode layer is substantially free from silicon.

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Hou, Y. T., et al., “High Performance Tantalum Carbide Metal Gate Stacks for nMOSFET Application,” IEEE, 2005, 4 pages.
Hsu, P. F., et al., “Advanced Dual Metal Gate MOSFETs with High-κ Dielectric for CMOS Application,” Symposium on VLSI Technology Digest of Technical Papers, IEEE, 2006, 2 pages.

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