Hybrid electrostatic chuck

Details Hybrid electrostatic chuck Hybrid electrostatic chuck

1994-01-21

1995-10-31

Gaffin, Jeffrey A.

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

361230, H02N 1300

Patent

active

054635268

ABSTRACT:
An electrostatic chuck comprises a hybrid dielectric between a wafer and an electrode. The hybrid dielectric is comprised of two layers; a thin insulating layer for attracting and holding the bottom of the wafer; and a mechanically and electrically robust semiconducting layer below. The resistivity of the semiconducting layer can cover a wider range of values for equivalent performance than has been achievable heretofore with Johnson-Rahbeck effect devices. The hybrid layer combines the high force/voltage ratio and quick charge/discharge features of a thin insulating dielectric chuck with the protection provided by a current limiting semiconducting layer. The hybrid layer chuck provides improved performance with simple, low cost structures.

REFERENCES:
patent: 4184188 (1980-01-01), Briglia
patent: 4665463 (1987-05-01), Ward et al.
patent: 4667110 (1987-05-01), Kariya
patent: 4692836 (1987-09-01), Suzuki
patent: 4962441 (1990-10-01), Collins
patent: 5001594 (1991-03-01), Bobbio
patent: 5117121 (1992-05-01), Watanabe et al.
patent: 5151845 (1992-09-01), Watanabe et al.
patent: 5166856 (1992-11-01), Liporace et al.

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