Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1998-05-20
1999-11-23
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257686, 257704, 257727, 257693, H01L 2348, H01L 2352, H01L 2940
Patent
active
059905662
ABSTRACT:
A semiconductor package and a method of fabrication are provided. The package includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate. Each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of the die. The polymer interconnect includes a flexible polymer tape with patterns of conductors. The conductors include microbumps for bonding to the die bond pads, and edge contacts for electrical connection to mating contacts on the substrate. The package also includes a force applying mechanism for biasing the dice against the substrate. In alternate embodiments, the polymer interconnect includes resilient edge contacts, cantilevered edge contacts, or multi level edge contacts.
REFERENCES:
patent: 5104324 (1992-04-01), Grabbe et al.
patent: 5107328 (1992-04-01), Kinsman
patent: 5138434 (1992-08-01), Wood et al.
patent: 5281852 (1994-01-01), Normington
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5678301 (1997-10-01), Gochnour et al.
patent: 5696033 (1997-12-01), Kinsman
patent: 5832601 (1998-11-01), Eldridge et al.
Akram Salman
Brooks Mike
Cloud Eugene
Farnworth Warren M.
Wood Alan G.
Clark Sheila V.
Gratton Stephen A.
Micro)n Technology, Inc.
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